Arc Technologies has the experience and tooling to polish a variety of materials, including metals, ceramics, glass, etc.  We have, in stock, slurries containing particles ranging from 30µm down to 0.1µm.  This gives us the ability to quickly remove hundreds of microns from your parts and finish them flat to within tenths of microns with Ra's in the 1 nanometer range.

Arc has state of the art fully automatic lapping for wafer backend processing of all thin film recording heads.

We are capable of processing a wide variety of materials.