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Flip Chip Assembly Services. We feature the SET FC150.
- Die Bonding, Focal Plane Arrays, MEMs, Opto-electronics, Die to Flex, Die to Wafer
- Mass Reflow, In-situ Reflow, and Fluxless Eutectic Bonding
- Gold, Gold/Tin, Lead/Tin, Indium, Epoxies, Adhesives
- Force and Thermal Process Recording
- Front Side and Back Side Heating
- Thermal Compression Bonding
- Cold Compression Bonding
- Tacking and Glue Bonding
- UV Curing and Heating
- Auto Leveling
- Accuracy of Placement +/- 1.0 µm ( 0.1 µm incremental move)
- 100 kg Force
- 450 C
- Nano Imprinting
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