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ARC Provides a Comprehensive Set of Analytical and Failure Analysis Services
Call 651.789.9000 and ask for Chris Wurst. Chris can schedule your analytical and FA work.
We specialize in Quick Turn services... |
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Analytic X-Ray EDS
Oxford Inca X-Ray analysis with Hitachi 3000 SEM - X-Ray mapping |
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Analytic X-Ray Fluorescence
X-Ray Fluorescence (XRF) Oxford Instruments Twin-X determines elemental composition and concentration of solids, liquids, powders and pastes. Features dual detectors for precision analysis of a wide range of elements (Na to U) with accuracy and reproducibility from high % to low ppm. |
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Atomic/Magnetic Force Microscopy (AFM/MFM)
Image sub-micron substrate features, magnetic imaging of magnetic domains and surface roughness measurement. Features include contact, non-contact, and tapping modes. |
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Cathode Luminescence
Analyze your optical chips at low temperature. |
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FLIR Thermal Analysis
Experimentally verify the thermal landscape of your prototypes, verify the thermal modeling you may have done. See where the hot spots are, and minimize them at the prototype level. |
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Focused Ion Beam (FIB)
TEM sample preparation, x-section analysis of devices and process steps, photo line width verification, and aspect ratio verification. Features include gas injection system for deposition of platinum and tungsten or enhanced etch. |
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Laser Scribing
Identify your critical samples for error free traceability before initiation of analysis. |
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Magnetic Materials Measurement and Analysis
Lakeshore VSM (hard) and SHB M109 B-H Looper (soft) for measuring magnetic properties such as coercivity, magnetic flux, magnetostriction, magneto-resistance, and loop squareness. Substrate holders accept 3" and 6" wafer sizes, along with special fixturing for smaller substrates. |
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Optical Microscopy (various tools)
Use these tools to view down to micron size features and device positions with sub-micron resolution to 50nm. Features include up to 8"x8"x8" working area, automated line width measurement, and flexible control software to measure custom features. |
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Profilometry
Determine film step heights, feature profiles, contours, and wafer stress. Features include 8" wafer stage with vacuum fixturing, extended range sensor for larger substrates, and sequential scan capability for 3-D stitching. |
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Scanning Electron Microscopy (SEM)
Hitachi S-3000N Variable Pressure EDS characterization with Oxford INCA x-ray analysis, Gatan Cold Stage, MonoCL2 Cathode Luminescence, backscatter w/ compositional, topological, and 3-D characterization. |
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Scanning Electron Microscopy (SEM)
Hitachi S-4700 field emission gun calibrated, high resolution SEM available for precision measurement and analysis. |
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Transmission Electron Microscopy (TEM) Sample Prep
TEM preparation includes Ultra-Microtome, FIB with ex-situ lift out, ion milling, tripod polishing, powder diffraction, and carbon coating. |
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