Precision Machining and Micromachining - Nanometer Resolution Submiron Precision
ARC has built one of the most precision and capable machine shops to be found anywhere.  ARC machines exotic materials such as Silicon Carbide, AlN, Sapphire, Zerodur Glass, Tungsten and other exteme materials.  ARC has micro EDM capability, Fine Wire EDM capability, turning and CNC Hard Milling.  In addition ARC has CNC Grinding, CMP, Lapping and Polishing operations as well as Wafer Slice and Dice and Wafer Backside Thinning.  The equipment set is unique and very non-traditional in terms of your typical machine shop.  The machine tools tools are equiped with such technology as air bear or high speed sindle technology, linear motors, 10 nm resolution scales and so on.  Supporting this is a nano-precision metrology lab, without which this level of machining cannot be accomplished.

ARC makes FIB Apertures, X-ray Apertures, SEM and TEM Apertures, probes, molds, die punch tools, all with feartures from a few nanometers to wafer scale substrates and chucks. 

Recently ARC is partnering with a sister company on diamond turning with air bearing spindles.  This technology will be brought in-house at some time in the future. 

Thin Films & Device Fabrication - MEMs and Other Fabrication Technologies - MEMs Mircomachining
ARC has many material deposition tools as well as front-to-back photolithography and etching systems.  ARC provides basic thin film coating services from alumina to zinc oxide, including dielectrics, precious metals, and specialty alloys, as well as multi-step device fabrication and device singulation.  Our films are used in magnetic recording, optical, sensors, and other industries.  Depending on your application needs, we can deposit multiple films without breaking vacuum    between processes.  ARC has expertise magnetic films using both sputtering and in plating.

ARC is a leading coater of various AFM probes.

Recently ARC has added Indium Evaporation to complement its Device Hybridization work. 

Electronics, Test Equipment and Instrumentation
ARC designs and builds complex electronic systems with a high level of integration, including such features as Field Programmable Gate Arrays (FPGA), Digital Signal Processors (DSP), and USB communication.

Internal capabilities include: FPGA and DSP Programming, Circuit Simulation (SPICE), PCB Design and Layout, Component Reliability Testing, and PC software interfaces. VB.NET and LabVIEW comprise ARC’s core software environments.  Additionally, our Senior Electrical Engineer is a LabVIEW Certified Associate Developer.

ARC can be your partner in your electronic system design, prototype, and test requirements.

Flip Chip Boding – Device Hybridization Lab – FC 150 - Advanced Packaging of Complex Systems
A big new area of interest for ARC; the Suss/SET FC150 is one of the most capable and accurate device bonders in the world. We can provide FC Services or we can make SiC and other tooling for your own FC machine. With ARC’s Thin Film and Photo expertise, we can provide bumping in Indium, Gold-Tin eutectic or other formulations. 

Many customers are now using ARC as it "Hybridization Fab" for advanced photonics, FPA and laser diode hybridization.

Analytical, Metrology, and Failure Analysis
ARC makes many things that require an extreme level of Metrology. 

ARC now offers these services to outside customers on a selected basis:  From IC Editing with our FIB, to high resolution SEM, to EDS, XRF, and Cathode Luminescence. Our beam tools and expertise can help your project. In addition to the Ion and Electron "Beam Tools", ARC has some of the finest optical inspection and touch probe metrology tools found anywhere.  Profilometers, AFM, Interferometers, and Ellipsometers are all to be found at ARC.

All ARC tools use NIST traceable standards and are meticulously maintained in addition to being used by engineers with many years of industry experience.

ARC can assist your analytical and metrology needs.